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[IR] Samsung Electro-Mechanics (009150) – Q2 2026 Earnings Presentation / 2026-07-30

Posted on July 30, 2026August 23, 2026 By ksb220805@gmail.com

๐Ÿ’ก 3-Second Summary

Samsung Electro-Mechanics posted Q2 operating profit of KRW 440.4B (12.7% operating margin), while Component and Package Solution revenue expanded on demand for AI infrastructure and automotive applications.

๐Ÿ“Š 1. [Key Guidance & Quantitative Roadmap Summary]

  • Q2 2026 Historical Financial Results
    • Revenue: KRW 3,457.2B (+8% QoQ, +24% YoY)
    • Operating Profit: KRW 440.4B (Operating Margin: 12.7%, +57% QoQ, +107% YoY)
    • Pre-tax Profit: KRW 433.3B / Net Profit (Attributable to Owners of the Parent): KRW 315.7B
    • Segment Revenue & Mix:
      • Component: KRW 1,649.4B (48% of total, +17% QoQ, +29% YoY)
      • Package Solution: KRW 771.6B (22% of total, +6% QoQ, +37% YoY)
      • Optics Solution: KRW 1,036.2B (30% of total, -4% QoQ, +10% YoY)
  • Financial Position & Cash Flow (Historical Data)
    • Total Assets: KRW 16,566.0B / Total Equity: KRW 10,529.1B
    • Cash & Cash Equivalents: KRW 3,314.4B / Total Borrowings: KRW 2,994.4B
    • Debt-to-Equity Ratio: 57% / Total Borrowing Ratio: 28% / Equity Ratio: 64%
    • Operating Cash Flow: KRW 556.8B in Q2 (H1 cumulative: KRW 1,035.7B)
  • Q3 Strategy & Outlook (Forecast & Strategy)
    • Component: Timely development of leading-edge AI MLCCs, active response to long-term supply agreements (LTAs) with multiple global tech customers, and expansion of high-capacitance ADAS and high-voltage xEV products.
    • Package: Continued supply expansion of high-value FCBGA for AI accelerators and server CPUs, supported by domestic and overseas capacity additions.
    • Optics: Expansion of high-spec camera modules for strategic foldables, customized solutions for global EV platforms, and initial mass production of sensing modules for humanoid robots.

๐Ÿš€ 2. [Business Strategy & Future Plans]

  • Component Division
    • Q2 Performance Factors: Revenue grew across all applications, led by industrial and automotive sectors, with high growth in AI servers, network, and power applications alongside ADAS and xEV expansion.
    • Q3 Strategic Focus: Accelerate timely development of high-capacitance and high-reliability MLCCs to address ongoing AI infrastructure investments, actively respond to long-term supply agreements (LTAs) with multiple global tech clients, and broaden entry into high-voltage xEV parts.
  • Package Solution Division
    • Q2 Performance Factors: Revenue growth was driven by expanded shipments of high-value FCBGA following mass production of new AI accelerator/server CPU products for global tech customers, initiation of AI data center network substrate supplies to new clients, and higher BGA shipments.
    • Q3 Strategic Focus: Address strong demand for data center FCBGA by continuing to expand supplies for global tech customers’ AI accelerators and server CPUs, while expanding production capacity in domestic and overseas facilities.
  • Optics Solution Division
    • Q2 Performance Factors: Despite seasonal quarter-on-quarter moderation, revenue rose YoY backed by mass production of 200MP folded zoom cameras, high-resolution lens assemblies, slim OIS, and automotive sensing/in-cabin cameras.
    • Q3 Strategic Focus: Broaden supply of high-spec slim OIS and Power Prism folded zoom modules for strategic new foldable devices, and pursue initial mass production of high-pixel sensing modules for humanoid robotics.

๐Ÿ“ Editor’s Comment (Management Perspective)

  • Core Growth Logic Analysis
    • Management identifies expanding AI infrastructure investments and the electrification/automation of vehicles (ADAS/xEV) as primary industry drivers.
    • In Component, the division is focusing on high-capacitance, high-reliability MLCCs and actively responding to long-term supply agreements with global tech firms. In Package Solutions, following the Q2 mass production of new AI accelerator and server CPU substrates, the division is executing domestic and overseas capacity expansions to support high-value FCBGA shipments.
    • Management is positioning high-value MLCCs and FCBGA substrates to capture continued AI infrastructure and automotive demand, following strong Q2 growth across the Component and Package Solution divisions.
  • Key Tracking Points
    • High-Value Substrate Execution & Capacity Expansion: Expansion of high-value FCBGA supplies for data centers and the progress of domestic/overseas Capa additions.
    • MLCC Long-Term Agreement Response & New Applications: Progress on LTA responses with global tech customers for MLCCs, market entry of high-voltage xEV parts, and initial mass production milestones for humanoid robot sensing modules.
    • Verification Sources: Subsequent quarterly reports, official Earnings Presentations, and regular corporate disclosures via DART.

๐Ÿ“ข Disclaimers & Source Information

Source: This content was newly synthesized and structured based on financial fact data from the company’s official IR materials and press releases.

Investment Risk Warning: This content is provided solely for informational and linguistic reference purposes. Future projections (guidance) included in IR materials are company estimates and do not guarantee future performance. Under no circumstances does this constitute financial advice or a recommendation to buy or sell specific securities. All investment decisions and financial liabilities rest entirely with the investor.

Contact: For compliance and copyright inquiries, please contact ksb220805@gmail.com.

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