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[IR] Samsung Electro-Mechanics (009150) – Q1 2024 Earnings Presentation / 2024-04-29

Posted on April 29, 2024August 23, 2026 By ksb220805@gmail.com

๐Ÿ’ก 3-Second Summary

Samsung Electro-Mechanics posted Q1 2024 revenue of KRW 2.6243T and operating profit of KRW 180.3B driven by flagship smartphone launches and high-value component supplies , while preparing to stabilize its new Vietnam facility to expand AI/server package substrates in Q2.

๐Ÿ“Š 1. [Key Guidance & Quantitative Roadmap]

  • Q1 2024 Financial Results (Historical Data)
    • Revenue: KRW 2.6243T (+14% QoQ, +30% YoY)
    • Operating Profit: KRW 180.3B (OPM 6.9%, +63% QoQ, +29% YoY)
    • Pre-tax Profit: KRW 219.5B (+250% QoQ, +53% YoY)
    • Net Profit (Controlling Interests): KRW 183.1B (+322% QoQ, +64% YoY)
  • Q1 2024 Revenue by Business Division
    • Component Unit: KRW 1.0230T (+5% QoQ, +24% YoY)
    • Optics & Communication Solution Unit: KRW 1.1733T (+32% QoQ, +47% YoY)
    • Package Solution Unit: KRW 428.0B (-3% QoQ, +8% YoY)
  • Financial Position (As of March 31, 2024)
    • Total Assets: KRW 12.1799T / Cash & Cash Equivalents: KRW 2.0183T
    • Total Liabilities: KRW 3.9627T / Total Borrowings: KRW 1.8343T
    • Debt-to-Equity Ratio: 48% / Total Borrowings-to-Equity Ratio: 22% / Equity-to-Asset Ratio: 67%
  • Q2 Market Outlook & Business Initiatives (Guidance/Plan)
    • Component: Meet gradual recovery in set demand with timely supply of high-value, small-size/high-capacitance IT MLCCs ; continue expanding sales in growth areas including AI servers and ADAS.
    • Package Solution: Expand supply centered on growing demand products including PC/server CPU FCBGA and memory BGA substrates ; establish timely response capability for server/AI accelerator substrates by ramping operations and mass production stabilization at the new Vietnam plant.
    • Optics & Communication Solution: Respond to demand for differentiated flagship and automotive products despite IT seasonality and slowing EV growth ; deliver timely high-performance cameras for new global flagship smartphones ; increase high-pixel automotive camera supply and enhance specialized technology lineups.

๐Ÿš€ 2. [Business Strategy & Future Plans]

  • Component Division
    • Respond in a timely manner to gradual set demand recovery by supplying high-value, small-size/high-capacitance IT MLCCs.
    • Sustain sales growth across industrial and automotive applications, including AI servers and ADAS.
  • Package Solution Division
    • Expand shipments of products seeing demand growth, such as PC/server CPU FCBGA and memory BGA substrates, in line with the projected gradual demand turnaround across downstream PC and server markets.
    • Secure operational and mass production stabilization at the new Vietnam plant to build a timely response system for high-value server and AI accelerator substrate demand.
  • Optics & Communication Solution Division
    • Address ongoing technology differentiation demands by executing timely deliveries of high-performance camera modules for new flagship smartphone models.
    • Expand shipments of high-pixel automotive camera modules and reinforce specialized technology product lineups.

๐Ÿ“ Editor’s Comment (Management Perspective)

The company views gradual recovery across downstream IT set markets (PCs and servers) , sustained smartphone specification upgrades , and demand growth in growth areas including AI servers and ADAS as its key business opportunities. Management’s core strategy centers on supplying high-value IT MLCCs while sustaining sales growth across AI server and ADAS applications , stabilizing operations at the new Vietnam plant to build a timely delivery system for server/AI accelerator FCBGA demand , and broadening high-performance mobile and high-pixel automotive camera module supplies.

Key tracking points moving forward include the operational stabilization progress of the new Vietnam facility and the timing of high-value FCBGA substrate shipments for server and AI accelerator applications in the Package Solution Unit. Additionally, investors should monitor the shipment expansion of high-value IT MLCCs and AI server/ADAS components in the Component Unit, as well as product lineup execution for high-pixel automotive camera modules in subsequent quarterly filings.

๐Ÿ“ข Disclaimer & Source

Source: This content was structured and newly generated based on official financial fact data from the company’s IR presentation and corporate disclosures.

Investment Risk Warning: This material is provided for informational and linguistic reference purposes only. Forward-looking statements and guidance are company estimates and do not guarantee future performance. This content does not constitute financial advice or an offer/solicitation to buy or sell securities. All investment decisions and financial responsibilities rest solely with the investor.

Inquiries: For compliance and copyright inquiries, please contact ksb220805@gmail.com.

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